KH560-SiO 2 /polyethersulfone/bismaleimide-phenolic epoxy resin (KH560-SiO 2 /PES/BMI-EPN) composite had been prepared and studied, in which BMI-EPN resin was used as matrix, PES resin and SiO 2 modified by silane coupling agent (KH560-SiO 2 ) as toughness reinforcing agent. The curing kinetics and the apparent activation energy of the resin system were studied and calculated by the non-isothermal differential scanning calorimetry. The micro-morphology was investigated by scanning electron microscope (SEM), and the mechanical, thermal and dielectric properties of the composites was analyzed. The morphology showed that PES resin and KH560-SiO 2 were evenly dispersed in the matrix and a multi-phase structure was formed. The flexural modulus, flexural and impact strength of composite were 4.2 GPa, 156.2 MPa and 20.9 kJ m −2 , with an increase of 31%, 50% and 83% than those of resin matrix, respectively, when the content of PES resin was 4 wt% and KH560-SiO 2 was 1.5 wt%. Furthermore, the thermal decomposition temperature ( T d ) of the composite was 393 °C which was 15 °C higher than that of resin matrix. The results of dielectric properties showed that the dielectric constant of the composite first decreased and then increased with the increase of KH560-SiO 2 doping content, and the dielectric loss did not change significantly. The dielectric constant and dielectric loss tangent were 4.55 and 0.0029 at 10 Hz, when the content of KH560-SiO 2 was 1.5 wt%. This study provided theoretical data for expanding the application range of phenolic epoxy and bismaleimide.
Despite the fact that PEDOT:PSS has been successfully used in the field of flexible electronics, some of its applications in the domain of rigid conductive coating have been limited by the pricey cost and subpar mechanical properties (hardness, adhesion, and moisture absorption) of the commercially available Clevios™ PH 1000, as well as the poor conductivity, film formation, and mechanical properties of the self-made PEDOT:PSS. In the process of investigating the low-cost preparation of PEDOT-based conductive polymer coatings, we discovered that self-made PEDOT:PSS, a waterborne epoxy resin, and a bio-based epoxy curing agent can be blended uniformly to produce good film-forming conductive coatings. Later, the addition of KH560-modified nano-SiO2further improved the coating’s hardness while ensuring a modest increase in conductivity. Meanwhile, the inadequacies of the epoxy resin, which are not UV-resistant, were considerably improved by the synergistic action of PEDOT:PSS and the modified SiO2. The result is a low-cost method designed for creating conductive coatings that are UV-resistant and may be utilized for electromagnetic, electrothermal, and antistatic shielding applications. Such a PEDOT:PSS/epoxy composite system and its design approach will broaden the scope of PEDOT:PSS’s application and will inspire future research in and practical implementations of PEDOT:PSS-based conducting coatings.Keywords:waterborne epoxy resin;PEDOT:PSS;high hardness;conductive coatings;bio-based;UV-resistant
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