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Preparation of Au–Ni bimetallic-coated monodisperse PS@Ni/Au microspheres with excellent conductivity and their application in acrylate-based anisotropic conductive adhesives

Tingting Liu,Baijun Liu,Mingyao Zhang

Anisotropic conductive adhesives (ACAs) provide an efficient and easy method of interconnecting small electronic devices compared to traditional solder joint connections. In this paper, PS@Ni/Au metal composite microspheres with excellent electrical conductivity in the size of 2.76 μm were prepared by chemical plating technique and in situ redox method. The effects of PS@Ni metal composite microspheres with different shell thicknesses and compactness on the preparation of Ni–Au bimetallic shell layers were investigated, and the effects of different Au:PS@Ni mass ratios on the volumetric conductivity of PS@Ni/Au metal composite microspheres were discussed. The composite microspheres were characterized by scanning electron microscopy (SEM), thermogravimetric analysis (TGA), energy spectrometry (EDS), and X-ray diffraction (XRD). Thick and compact Ni metal shells are the key to preparing PS@Ni/Au metal composite microspheres with the complete degree of encapsulation. When the mass ratio of Au:PS@Ni was 0.15:1, the conductivity was as high as 1.3 × 10 5  S cm −1 . The acrylate pressure-sensitive containing 3.1–8.3 vol% conductive particles presented an obvious anisotropy. When the mass ratio of the conductive particles was higher than 8.3 vol%, the conductive particles appear to be significantly aggregated. The research ideas and methods have great application potential for replacing the traditional solder joint connections.