Introduction This research was to evaluate the beneficial effects of Styphnolobium japonicum (L.) Schott flower extract (SJF) on the adjuvant-induced arthritis rat model.Methods Arthritis was evoked by injection of complete Freund’s adjuvant (CFA) in the hind paw. SJF (150 or 300 mg/kg/day) or Celecoxib (5 mg/kg/day) were administered intragastrically from the 0th day to the 28th day. The arthritis symptoms (paw edema, arthritic scores, mechanical hyperalgesia, and thermal hyperalgesia), inflammation biomarkers (RT and CRP), related enzymes (MMP1 and MMP13), oxidative stress markers (CAT, SOD, GPx, and MDA), and inflammatory cytokines (IL-6, IFN-γ, TNF-α, and IL-1β) of SJF-treated CFA rats were evaluated.Results CFA rats exhibited severe arthritis symptoms, increased oxidative stress, and inflammatory cytokines. Interestingly, SJF treatment relieving arthritis symptoms and restored body weight gain compared with those in the CFA group. SJF treatment decreased the levels of CRP, RF, MMP1, and MMP13 in the CFA group. Besides, SJF treatment increased the activities of antioxidant enzymes and decreased the MDA content and inflammatory cytokines compared with those in the CFA group. Moreover, SJF could increase the mRNA expression of GPx-1 and CAT and inhibit the mRNA expression of IL-6 and TNF-α in the ankle tissue of CFA rats.
Heat dissipation has become a bottleneck restricting large-scale integration and flexible electronic technologies. This study reports a novel fabrication strategy to prepare flexible stachytarpheta jamaicensis flower-like hexagonal boron nitride nanoribbons (SJF-BNNBs) and their composite films with polyimide (PI). The effect of synthesis conditions on the morphology of SJF-BNNBs was investigated, and the growth mechanism was proposed. The in-plane and through plane thermal conductivities of the 4 wt% SJF-BNNBs/PI composite film reach 5.98 W m −1 K −1 and 0.79 W m −1 K −1 , which are 3047 % and 316 % higher than those of the pure PI film, respectively. The in-plane and through plane thermal conduction enhancement efficiencies reach 761.8 % and 78.9 %, respectively. The tensile strength of the composite film is 61.7 % higher than that of pure PI, and maintains excellent electrical insulating and thermal stability properties. Infrared imaging tests verified the excellent heat dissipation performance of the composite film as a thermal interface material and a flexible copper clad laminate substrate, where the operating temperature of device could be reduced by 17.3 °C. To the best of our knowledge, SJF-BNNBs outperform the most efficient thermally conductive electrically insulating filler and are to break the overcome of polymer composites in heat dissipation applications.
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