ChemCatChem
·
2013
·Vol. 5
·期 12
·3788-3793
·
IF 5.181
Yajun Xu,Lei Wang,Wenwen Jiang,Hongwei Wang,Jianlin Yao,Qinghua Guo,Lin Yuan,Hong Chen
Graphical No need to be noble: Hydrogen fluoride-treated silicon nanowire arrays (H-SiNWAs) are an efficient, recyclable catalyst for the chemical reduction of nitrobenzene derivatives. The activity of H-SiNWAs is because of the presence of Si H bonds and the length of the nanowires. Silicon nanowire arrays (SiNWAs) are under extensive investigation for solar cells and biomedical applications. This study reports for the first time that hydrogen fluoride-treated (H)-SiNWAs are an efficient catalyst for the reduction of nitrobenzene derivatives. We show that SiNWAs, after hydrogen fluoride treatment, have a high catalytic activity in p -nitrophenol (PNP) reduction. The conversion rate of PNP by H-SiNWAs increases with time and is almost complete within 30 min, which thus indicates catalytic activity comparable to that of platinum nanoparticles. The catalytic activity of SiNWAs is closely related to the chemical composition and specific morphology of the surface. Si H bonds on the surface are essential for activity, and arrays with longer nanowires showed a higher catalytic activity. Moreover, the activity can be easily regenerated by hydrogen fluoride treatment. It was also found that H-SiNWAs exhibit a similar catalytic activity for the reduction of other nitrobenzene derivatives such as p -nitroaniline and sodium m -nitrobenzenesulfonate. It is concluded that H-SiNWAs may be considered as an environmentally friendly alternative to noble-metal-based catalysts for the reduction of nitrobenzene derivatives.
研究领域:
材料科学
·
化学工程
·
环境科学
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产品关联
DOI
高影响因子
MOLECULES
·
2023
·Vol. 28
·期 10
·4082
·
IF 4.6
Jinbo Yang,Xiangxue Cao,Lanfeng Wei,Jianshu Zhang,Jinli Zhang,Ping Liu,Liang Xu,Pengfei Li
Herein, a four-coordinated organoboron compound, aminoquinoline diarylboron (AQDAB), is utilized as the photocatalyst in the oxidation of silane to silanol. This strategy effectively oxidizes Si–H bonds, affording Si–O bonds. Generally, the corresponding silanols can be obtained in moderate to good yields at room temperature under oxygen atmospheres, representing a green protocol to complement the existing preparation methods for silanols.Keywords:photocatalytic oxidation;silane;silanol;aminoquinoline diarylboron
研究领域:
有机化学
·
光化学
·
催化
·
绿色化学
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DOI
高影响因子
Journal of Materials Chemistry C
·
2021
·Vol. 9
·期 25
·8020-8028
·
IF 7.393
Minghao Yi,Xunjun Chen,Peter S. Shuttleworth,Lewen Tan,Yunqing Ruan,Yixin Xu,Jiefeng Zheng,Shufang Wu,Sen Hu,Simin Xie,Zhixing Guan,Guoqiang Yin,Yingde Cui
Transparent and easily fabricated films were obtained through the coupling of eugenol, a bio-sourced feedstock, and poly(methylhydrosiloxane), via the Piers–Rubinsztajn reaction and Pt-catalysed hydrosilylation. The precursor reagents are readily available and economical, and the reaction process used was mild and easily undertaken. Additionally, poly(methylhydrosiloxane), having an abundant source of pendant Si–H groups, can be cross-linked with eugenol at multiple juncture points, and thus the eugenol content in these films ranges from 13.12 to 45.42 wt%. It was found that as the eugenol content increased, the thermal stability of the films also improved, with T10% and Rw at 700 °C ranging from 350.1 to 584.3 °C and 46.41 to 86.63%, respectively, which is higher than other analogous biomass-derived polysiloxanes. Crucially, the prepared films also exhibited suitable optical properties, with a >90% transmittance within the 430–1100 nm region and near 100% absorbance in the UV region (<350 nm), verifying their potential applications as optical encapsulants. Aside from good light transmittance, the refractive index of the films increased from 1.44 to 1.52 (at 450 nm) with higher ratios of eugenol. This demonstrates their suitability for use as high-refractive index (>1.5) LED encapsulants and also in stacked multi-layer reflectors. In addition, to protect the encapsulated chips from moisture erosion, these films exhibit good water vapour barrier properties and water repellence.
研究领域:
材料科学
·
化学工程
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DOI
高影响因子
ACS Omega
·
2026
·Vol. 11
·期 30
·45485-45493
·
IF 5.2
Ye Zhixuan,Chen Xingshu,Zhang Linxin,Wang Jun,Chen Hanxian,Zhang Xinxiang,Zhao Weiwei,Yuan Zhanhui
The abundant hydrophilic
hydroxyl groups and porous structure make
wood highly susceptible to moisture absorption from the environment,
leading to issues such as deformation and decay. This work aims to
in situ construct a multifunctional organosilicon/organic hybrid resin
coating on the wood surface derived from the click reaction of polymethylhydrosiloxane
(PMHS), using PMHS, divinylbenzene (DVB), and the Karstedt catalyst.
At room temperature, through the Si–H addition click reaction
between PMHS and DVB, a cross-linked and rigid hybrid resin coating
with a hardness of 94.00 HA is fabricated on the wood surface. Simultaneously,
a dehydrogenation click reaction takes place between the Si–H
groups of PMHS and the –OH groups on the wood surface, anchoring
the hybrid resin coating to the wood via covalent bonds. These endow
the hybrid resin coating with excellent mechanical stability. The
low surface energy of organosilicon resin in the hybrid coating affords
the modified wood with good waterproofness by decreasing the 24 h
water absorption rate from 78.6% to 13.9%. Most importantly, the coating
remains hydrophobic even after being immersed in an alkaline solution
(pH = 13) for 24 h. SEM images of the coating after alkaline corrosion
indicate that while the Si–O–Si skeleton of the organosilicon
component is partially dissolved due to its susceptibility to alkali,
the hydrophobic organic resin skeleton remains intact, imparting good
alkali resistance to the hybrid resin coating. In summary, the organosilicon/organic
hybrid coating constructed via the click reaction of PMHS on the wood
surface effectively addresses the issue of poor alkali resistance
commonly associated with traditional organosilicon coatings.
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产品关联
DOI
PubMed
高影响因子
Surfaces and Interfaces
·
2024
·
IF 5.7
Zihan Zhou,Yunwen Wu,Silin Han,Tao Hang,Huiqin Ling,Jie Guo,Su Wang,Ming Li
3D NAND is one of the most promising storage devices due to its high storage density and low energy consumption. Selective wet etching of Si 3 N 4 by hot-concentrated phosphoric acid (PA) solution is a key process for 3D NAND fabrication. However, the channel material, polycrystalline silicon (poly-Si), is unexpectedly dissolved due to its inevitable exposure to the PA etching solution, which causes device failure and thus limits the stacking density of 3D NAND. Herein, to avoid the detrimental dissolution of poly-Si, we unveil the mechanism of poly-Si dissolution in PA solution from kinetic and thermodynamic perspectives. We find that the etch process shows a two-stage reaction, in which H 2 O plays a key role in lowering the activation barrier for poly-Si etching. Further thermodynamic analysis demonstrates that poly-Si prefers to be oxidized by H 2 O to suboxide rather than to SiO 2 . Combined with surface chemistry characterization, we propose the dissolution mechanism as a two-stage process involving the dissolution of suboxide interface and bulk poly-Si, where the nucleophilic substitution of Si–H with Si–OH on bulk poly-Si surface determines the overall etch rate. This study advances the 3D NAND development by establishing a theoretical foundation for identifying and implementing efficacious strategies to impede detrimental dissolution.
研究领域:
半导体器件
·
材料科学
·
纳米技术
·
化学工程
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DOI
高影响因子
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