The exceptional corrosion resistance and combined physical and chemical self-cleaning capabilities of superhydrophobic photocatalytic coatings have sparked significant interest among researchers. In this paper, we propose an economical and eco-friendly superhydrophobic epoxy resin coating that incorporates SiO2@CuO/HDTMS nanoparticles modified with Hexadecyltrimethoxysilane (HDTMS). The application of superhydrophobic coatings effectively reduces the contact area between the metal surface and corrosive media, leading to a decreased corrosion rate. Additionally, the incorporation of nanomaterials, exemplified by SiO2@CuO core–shell nanoparticles, improves the adhesion and durability of the coatings on aluminum alloy substrates. Experimental data from Tafel curve analysis and electrochemical impedance spectroscopy (EIS) confirm the superior corrosion resistance of the superhydrophobic modified aluminum alloy surface compared to untreated surfaces. Estimations indicate a significant reduction in corrosion rate after superhydrophobic treatment. Furthermore, an optical absorption spectra analysis of the core–shell nanoparticles demonstrates their suitability for photocatalytic applications, showcasing their potential contribution to enhancing the overall performance of the coated surfaces. This research underscores the promising approach of combining superhydrophobic properties with photocatalytic capabilities to develop advanced surface modification techniques for enhanced corrosion resistance and functional properties in diverse industrial settings.
Electrocatalytic CO2reduction driven by renewable electricity offers a sustainable approach to producing valuable chemicals, though it is often hindered by low activity and selectivity. CuO, an important transition metal oxide, exhibits unique advantages in photoelectrocatalysis due to its high intrinsic catalytic activity and ability to serve as an active site for CO2reduction. SiO2, a widely used substrate, facilitates Cu loading and increases the specific surface area of the catalyst. Meanwhile, g-C3N4provides excellent visible-light responsiveness and efficient charge carrier mobility. Together, CuO, SiO2, and g-C3N4are earth-abundant, low-cost, and chemically stable, making them ideal for solar-to-fuel applications. Here, a novel ternary heterojunction photocatalyst was constructed using SiO2, CuO, and g-C3N4. The heterostructure significantly improves light-harvesting efficiency, promotes efficient charge separation and transport, and simultaneously mitigates photogenerated carrier recombination and catalyst corrosion. The resulting SiO2@CuO/g-C3N4catalyst demonstrates outstanding CO2conversion performance, achieving a CO yield of 17 mmolg−1h−1at 1.2 VRHEwith nearly 100% selectivity. Moreover, this work systematically investigates the electrocatalytic CO2reduction reaction (CO2RR) mechanism on Cu-based catalysts, offering insights into the formation of high-value multicarbon products and highlighting the potential of rational heterojunction design in enhancing solar-driven fuel production efficiency.
Sapphire, with its superior optical and thermal properties, is an increasingly attractive high-performance substrate material for advanced LED packaging. However, its inherent surface characteristics-namely the absence of grain boundaries and strong chemical inertness-pose significant challenges for conventional metallization processes, severely limiting its broader application in electronic packaging. To address this critical issue, this study develops a novel silver conductive paste incorporating a custom-designed ZnO–B 2 O 3 –SiO 2 –CuO (ZBSC) glass frit as the inorganic binder. A robust silver thick film was successfully fabricated on a sapphire substrate via a thick-film metallization process. We systematically investigate the effect of sintering temperature on the film's microstructure and properties. The results demonstrate that the ZBSC glass exhibits excellent comprehensive performance and exceptional compatibility with the sapphire substrate. A key finding is the in-situ formation of a spinel CuAl 2 O 4 phase at the interface during sintering, resulting from a chemical reaction between the glass frit and the substrate. This interfacial reaction is crucial for achieving superior bonding. Optimized at a sintering temperature of 850 ℃, the silver film exhibits outstanding comprehensive performance: an ultra-low sheet resistance of 2.03 mΩ/□ and a high shear strength of 21.97 MPa. This performance is attributed to a dense, well-sintered silver microstructure with a continuous and complete conductive network, intimately bonded to the sapphire substrate. This work not only provides a high-performance solution for sapphire metallization but also offers new insights into the role of interfacial chemistry in thick-film technology. The proposed method represents a high-quality, reliable metallization technique with significant promise for advanced electronic packaging applications.
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