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,适用于对基线干扰要求严格的色谱和分析工作流程。
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在色谱分析、有机合成和交叉偶联反应领域已被 0 篇同行评审文献引用。
Description
Highly conductive silver ink for Printed Electronics applications on flexible substrates. The low resistivity is resulting from the fusion of the metallic nanosilver particles during the sintering process.Key BenefitsLow volume resistivityCompatible with several sintering methodsGood adhesion on coated and synthetic papers, treated and untreated PETSupport for industrial print headsHigh stability and easy handlingTypical Properties of Printed and Sintered ProductSingle pass printed with KM1024i LHE on PowerCoat(TM) HD1 and sintered with NIR lamp.Resistivity <3 mW//25μmDry Film Thickness 1-2 μmPrinting resolution 150 μm lines & gapsAdhesion 0-1 (ISO 2409 crosshatch test, no material removal)Conductive nanosilver inks are made up of silver nanoparticle colloids and suspensions, which are majorly used in printed electronics. Their applications include flexible displays, printed circuit boards, solar cells, and disposable electronics.(3)
Description
Highly conductive silver ink for Printed Electronics applications on flexible substrates. The low resistivity is resulting from the fusion of the metallic nanosilver particles during the sintering process.Key BenefitsLow volume resistivityCompatible with several sintering methodsGood adhesion on coated and synthetic papers, treated and untreated PETSupport for industrial print headsHigh stability and easy handlingTypical Properties of Printed and Sintered ProductSingle pass printed with KM1024i LHE on PowerCoat(TM) HD1 and sintered with NIR lamp.Resistivity <3 mW//25μmDry Film Thickness 1-2 μmPrinting resolution 150 μm lines & gapsAdhesion 0-1 (ISO 2409 crosshatch test, no material removal)Conductive nanosilver inks are made up of silver nanoparticle colloids and suspensions, which are majorly used in printed electronics. Their applications include flexible displays, printed circuit boards, solar cells, and disposable electronics.(3)