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Machining water through laser cutting of nanoparticle-encased water pancakes

Journal 2023 · IF 16.6 · 14(1): 1-14 · 发表于 2023 年 6 月 29 日
作者: Niu Jicheng,Liu Wenjing,Li Jasmine Xinze,Pang Xianglong,Liu Yulin,Zhang Chao,Yue Keyang,Zhou Yulin,Xu Feng,Li Xiaoguang,Li Fei
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摘要

Due to the inherent disorder and fluidity of water, precise machining of water through laser cutting are challenging. Herein we report a strategy that realizes the laser cutting machining of water through constructing hydrophobic silica nanoparticle-encased water pancakes with sub-millimeter depth. Through theoretical analysis, numerical simulation, and experimental studies, the developed process of nanoparticle-encased water pancake laser cutting and the parameters that affect cutting accuracy are verified and elucidated. We demonstrate that laser-fabricated water patterns can form diverse self-supporting chips (SSCs) with openness, transparency, breathability, liquid morphology, and liquid flow control properties. Applications of laser-fabricated SSCs to various fields, including chemical synthesis, biochemical sensing, liquid metal manipulation, patterned hydrogel synthesis, and drug screening, are also conceptually demonstrated. This work provides a strategy for precisely machining water using laser cutting, addressing existing laser machining challenges and holding significance for widespread fields involving fluid patterning and flow control in biological, chemical, materials and biomedical research.

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