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An impact-strengthening, reusable hot-melt structural adhesive derived from branching polyurethane-based supramolecular topology capped by self-complementary hydrogen bonding UPy motifs

Journal 2023 · IF 6 · 发表于 2023 年 6 月 24 日
作者: Yu Yuan,Shihu Zhu,Jun Zhu,Peixin Niu,Ailing Sun,Xingjiang Liu,Liuhe Wei,Yuhan Li
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摘要

The miniaturization and reliability of portable electronics are increasingly dependent on structural adhesive while developing detachable, reusable, and recyclable adhesives remain great challenge. Herein, we developed a novel strategy of incorporating self-complementary quadruple hydrogen bonds into multi-branch polyurethane as terminal motifs to construct supramolecular adhesive. Impressively, the as-synthesized TPU-UPy was endowed with a high adhesion strength of 6.8 MPa for steel and featured excellent multiple reusability with more than 70% of the original adhesion strength remained even after reuse for five times. More importantly, it exhibited increasing trend of adhesive strength as the stretching speed increases, suitable for application of anti-impact. The way of generating UPy motifs by this synthetic route did not involve excessive consumption of reactants, which was potential to be industrialized. Thus, the TPU-UPy is a candidate hot melt adhesive that can be put into practical use of portable electronics encountering occasional impact.

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