Dual-anchor anti-corrosion coating of copper foil for high-speed interconnects

In this experiment, two similar molecules with bifunctional groups have been characterized to prove the advantages of dual-anchor molecular coating in the interfacial modification of the copper foil. The physicochemical properties of the modified copper foils have been studied. The obtained results indicate that the anti-corrosion performance and peeling strength were significantly improved for the copper foil treated with (2-(Methylthio)pyrimidin-4-yl)methanamine (MET), whose bonding information was analyzed via the density functional theory calculation. It was found that the S-Cu and N-Cu bonds were both formed on the Cu (1 1 1) surface for MET coating, and the adsorption of the double anchor points improves the stability of the interface. The peeling test exhibits the function of MET coating as the adhesion promotor between low-surface profile copper and resin for high-speed signal transmission.