摘要
Efficient thermal management materials are an integral part of electronic devices and can quickly contribute to their heat dissipation, thereby greatly improving their reliability, stability and service life . However, the inherent hygroscopicity of the film surface sets obstacles to the reliability and structural stability of electronic devices. To address these issues, a bionic structural design was obtained by spraying a polyurethane/stearic acid/zinc oxide‑iron oxide composite powder (TPU/STA/ZnO@Fe 2 O 3 ) on the surface of graphene composite films . At the same time, the graphene composite film has a high in-plane thermal conductivity (up to 533 W −1 ·m −1 ·K −1 ) and is able to reduce the film surface temperature to room temperature within 5 s due to its highly ordered layered design and strong hydrogen bonding interactions. In addition, the composite film offers a range of advantages such as good hydrophobicity and electrical conductivity . With a water contact angle of up to 159.5 ± 2° and an electrical conductivity of up to 3 × 10 3 S/m in steady state , the results show that the superhydrophobic graphene composite film has good physical, chemical and mechanical stability, as well as self-cleaning capabilities. It also retains good flexibility and reliability under 350 bending cycles. In this regard, the development of graphene composite films with high thermal conductivity , high superhydrophobicity, good electrical conductivity and flexibility is expected to be used as thermally conductive materials , opening up a new path in the field of thermally conductive heat dissipation materials for electronic components.
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