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Thermal insulation of 3D printed complex and miniaturized SiO2 aerogels at medium-high temperatures

Journal 2023 · IF 3.5 · 发表于 2023 年 3 月 1 日
作者: Yuting Wang,Chengyi Chu,Chenqi Duan,Jiajing Dong,Hao Chen,Songtao Ying,Jianjun Guo,Gaojie Xu,Fang Hu,Yuchuan Cheng,Aihua Sun
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摘要

Due to aerogel's network structure, specific surface area, and high porosity, SiO 2 aerogel has excellent thermal insulation and inferior mechanical properties. It is challenging to produce micro-objects and complex-shaped objects accurately by traditional manufacturing method because of the fragile mechanical properties. Here, we use 3D printing to fabricate SiO 2 aerogels. At the same time, we add opacifiers to reduce the aerogel's medium-high temperature thermal conductivity. The thermal conductivity of the SiO 2 aerogel printed in the experiment is as low as 0.028 W/(m·K) at room temperature. The aerogel doped with 10 wt% SiC has the best thermal insulation at medium-high temperatures. And the 3D printed aerogel doped with 10 wt% SiC has a compression performance of 1.19 MPa, which is more than 10 times better than the usual aerogel. This paper provides a method for creating micro-objects and complex-shaped objects with excellent medium-high temperature thermal insulation using Direct Ink Writing (DIW).

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