Flexible, robust, sandwich structure polyimide composite film with alternative MXene and Ag NWs layers for electromagnetic interference shielding

The design and fabrication of electromagnetic interference shielding films with a novel structure to eliminate undesirable electromagnetic pollution is an important research direction. However, it is still a challenge to combine and organize nanofillers in different dimensions into the structured network in polymer-based electromagnetic interference (EMI) shielding composites. In this work, a sandwich structure polyimide (PI) composite film with alternative 2D-MXene network and 1D-Silver nanowires (Ag NWs) network was prepared through the “electrospinning-immersion-hot pressing” method. With the increase of Ag NWs content, the EMI shielding effectiveness (SE) gradually increases while maintaining good flexibility and mechanical robustness. The EMI SE and the tensile strength of 150 μm thick sandwich composite film can reach up to 79.54 dB and 39.82 MPa, respectively. The prepared flexible and robust PI composite film with a sandwich structure has high EMI SE with less metal content, which can provide guidelines for the development of high-performance EMI polymeric films with potentials in wearable devices and equipment.