Distribution Behaviors of As, Sb, Bi, Sn, Se, Te, Au and Ag Between Cu and Liquid Metal Phases in the Cu-Pb Binary System at 500–1080°C

The present study focused on the Cu-Pb system and investigating the distribution behaviors of various minor elements through the equilibration-quenching-EPMA analysis experimental technique. Obtained results showed that: (1) An intermetallic compound consisting mainly of Cu-Pb-Se-Te formed below 956°C. (2) As, Sb and Sn had similar distribution behaviors, which mainly entered the solid Cu phase at the temperature range of 500–900°C, but became concentrated in the liquid alloy phase at temperature range of 900–1060°C, and their distribution ratios increased along with increasing temperature. (3) Bi was mainly found in the liquid alloy phase, and its distribution ratio ranged from 6.8 to 836.5 at the experimental conditions. (4) Se and Te formed an intermetallic alloy phase under 900°C, and they enriched in the liquid alloy phase between 960°C and 1060°C. (5) Au was mainly found in the solid Cu phase at the temperature range of 500–900°C, and its distribution ratio was about 1.5 at 900–1060°C. The distribution ratio of Ag decreased from 8.7 to 2.3 when increasing the temperature from 500°C to 1060°C. Distribution behavior of As, Sb, Bi and Sn is consistent with their interfacial enthalpies with Cu and Pb.