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Enhanced out-of-plane thermal conductivity of polyimide composite films by adding hollow cube-like boron nitride

Journal 2022 · IF 5.532 · 发表于 2022 年 12 月 14 日
作者: Song Zuo,Maohua Li,Shaoxiong Xie,Jinpeng Luo,Lexiang Xu,Yan Shi,Ningxiang Lan,Lang Zhou,Jinhong Yu,Xiaomin Li,Chuanqiang Yin
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摘要

Boron nitride nanosheet (BNNS) is widely used in electronic thermal management due to its excellent planar thermal conductivity and insulating properties. However, it is challenging to improve the out-of-plane thermal conductivity of BNNS-doped composites due to the anisotropy of the thermal conductivity of BNNS. Therefore, the BNNS in the matrix must be oriented to obtain composites with high out-of-plane thermal conductivity. In this study, BNNS powders with directional structures were synthesized directly using sodium chloride templates. The as-obtained BNNS powders have a unique hollow cube-like structure with an ultra-low density of 2.67 × 10 −2  g/cm 3 and nearly 8 times the volume of the same mass of two-dimensional (2D) BNNS, making it easy to form the out-of-plane thermal conductivity paths in the polymer matrix . In addition, the high out-of-plane thermal conductivity of 4.93 W m −1  K −1 at 23.3 wt% loadings was obtained by doping it into a polyimide (PI) matrix. This value is 9.7 times higher than that of 2D BNNS-doped PI at the same loadings, 17.6 times higher than pure PI, and 6.1 times higher than the thermally conductive PI film sold by DuPont. Therefore, the prepared composite film has great potential for application in electronic thermal management.

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