Photosensitive Si3N4 slurry with combined benefits of low viscosity and large cured depth for digital light processing 3D printing

Digital light processing 3D printing can be applied to fabricate complex silicon nitride (Si 3 N 4 ) components. However, because of the surface hydroxyl groups and large refractive index , it is still a foremost challenge to realize a stable photosensitive Si 3 N 4 slurry with combined benefits of low viscosity and large curing depth. In this study, we propose a new formulation strategy to prepare Si 3 N 4 slurry. Starting from the optimization of monomer ratio, we have systematically optimized powder particle size, dispersant and photoinitiator on the rheological properties and curing properties of Si 3 N 4 slurry. Specifically, we have fabricated a stable photosensitive Si 3 N 4 slurry (48 vol%) with a viscosity of 2.09 Pa s (30 s −1 ), a critical curing energy of 126.09 mJ/cm 2 and a maximum curing depth of 80 µm. Finally, based on this optimized slurry, we have successfully obtained complex Si 3 N 4 green body with no defect, which demonstrates great potential to fabricate arbitrary complex ceramic components for various applications.