Thermosetting epoxidized polybutadiene/low-molecular weight polyphenylene oxide compatible system with quite low-dielectric constant and loss prepared through co-curing reaction

Through the redistribution reaction of PPO, the hydroxyl-terminated low molecular weight PPO (PPO-OH) was prepared. Furthermore, after the reacting of PPO-OH with methacrylic anhydride, the double-bond-terminated low-molecular weight PPO (R-PPO) were synthesized, its M n was 2631 g/mol. The R-PPO were co-cured with epoxidized polybutadiene (JP-100) to prepare JP-100/R-PPO cured systems. The JP-100/R-PPO cured systems showed single-phase morphology. The co-curing reaction with R-PPO could effectively improve the thermal performance of JP-100, the glass transition temperature ( T g ) of cured JP-100/R-PPO systems raised greatly. For the cured JP-100/R-PPO (100/30) system, its T g was 192°C. The dielectric constant and dissipation factor of cured JP-100/R-PPO systems were both decreased and showed good frequency stability. The dielectric constant and dissipation factor at 1 MHz of cured JP-100/R-PPO (100/30) system were 2.61 and 0.0038, respectively, were obviously lower than those of cured JP-100 system (which were 3.10 and 0.0099, respectively). The JP-100/R-PPO systems exhibited an excellent thermal stability. The 5% weight loss temperature ( T 5% ) of cured JP-100/R-PPO system was around 340°C.