摘要
Graphene oxide (GO) was prepared by improved Hummer's method and silica hollow sphere (SHS) was fabricated by improved template method. The GO-SHS hybrids were prepared by modified SHS attached to modified GO surface, following which the GO-SHS hybrids were introduced into the epoxy resin (EP) matrix to synthesize GO-SHS/EP composites. The results showed that the mechanical and dielectric properties of GO-SHS/EP composites were enhanced. With the content of 0.3 wt.% GO-3 wt.% SHS, the GO-SHS/EP composites achieved impact and flexural strengths of 23.4 kJ/m 2 and 148.4 MPa, respectively, which improved 369% and 72%, respectively, compared with pure EP. At 10 3 Hz, the dielectric constant of GO-SHS composite is 3.17, which is significantly lower compared to 3.79 for pure EP. This will provide an opportunity to expand the application of epoxy composites in electronic packaging.
危险品化学品经营许可证(带存储)