SiC paste with high curing thickness for stereolithography

In this study, the method and mechanism of the improvement of the curing thickness of SiC by stereolithography (SLA) were investigated, the rheological properties of SiC paste were optimised, and the problem of cracking problem during debinding was solved. The best moulding process for preparing SiC ceramics with the Ceramaker 900 equipment was studied. Oxidation at 1180 °C for 1 h and hydroxylation with 0.6 mol/L H 2 O 2 were the best modification processes for SiC powder. SiC paste with good rheological properties and high curing thickness was prepared using a resin system of BPA, HDDA, TPGDA, TMPTA, DPHA, and A-BPEF (mass ratio = 9:7:5:20:15:6). The best debinding process for SLA SiC was segmented debinding. The bulk density, total porosity, and room temperature bending strength of the SiC ceramics obtained are 2.13 g/cm 3 , 10.2%, 229 MPa, respectively. The nanoindentation elastic modulus and hardness of SLA SiC ceramics were found to be 18.7 and 1.66 GPa, respectively. Through this process, a lattice structure of SiC parts with good surface quality was prepared.