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Synthesis and application of cyclotetrasiloxane modified with epoxy resins

Journal 2021 · IF 2.87 · 79(9): 7177-7192 · 发表于 2021 年 8 月 5 日
作者: Pan Zhaoqun,Chen Mianfeng,Zeng Keling,Kang Yingzi
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摘要

In this paper, a cyclotetrasiloxane modified with epoxy resin was synthesized via hydrosilylation with 1, 3, 5, 7-tetramethylcyclotetrasiloxane (D4H) and 4-vinyl-1-cyclohexane 1, 2-epoxide (VCHO). The structure of tetramethylcyclotetrasiloxane modified with cyclohexane epoxide (D4H–VCHO) was characterized by Fourier transform infrared (FT-IR), 1H nuclear magnetic resonance (1H-NMR) and gel permeation chromatography (GPC). The effects of feeding methods, feeding ratios, catalyst dosages, reaction temperature and reaction time on the products were investigated. After 4-h reaction with 8 ppm catalyst at 90 °C, D4H–VCHO was obtained with an epoxy value of 0.521 and a refractive index of 1.4920. Then, with 4-methylhexahydrophthalic anhydride as a curing agent and tetrabutylammonium bromide as a catalyst, the obtained D4H–VCHO was cured at 90 °C for 1 h and then 120 °C for another hour. The cured products showed high light transmittance, strong thermal stability, suitable hardness and low water absorption. The glass transition temperature of cured materials was 151.6 °C, indicating the improvement of flexibility. In addition, the introduction of epoxy groups greatly enhanced the adhesion of silicone resins to substrates. The results demonstrated that the epoxy-modified silicone materials could be applied as LED packaging materials.

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