Thermal conductivity and electrical insulation properties of h-BN@PDA/silicone rubber composites

In recent years, with the increasing demands of portable and high-speed electronic devices, highly integrated equipment attracts people's attention more and more. However, it is a great challenge to guarantee the long-term stability of electronic products at high temperatures. Hexagon boron nitride (h-BN), which owned excellent thermal conductivity and insulation properties , was preferred for electronics. For better compatibility of inorganic fillers and silicone rubber, a biological modification by coating polydopamine (DA) on h-BN was adopted. Herein, the composites based on h-BN@PDA and silicone rubber were fabricated. Compared with h-BN/silicone rubber composites , the thermal conductivity of h-BN@PDA/silicone rubber composites increased and volume resistance of materials had been decreasing. When the amount of h-BN@PDA fillers was 30 wt%, the thermal conductivity of h-BN@PDA/silicone rubber composite increased to 0.95 W m −1  K −1 . The volume resistivity of 30 wt% h-BN@PDA/silicone rubber composite reached 2.5 × 10 11  Ω·cm, which was the lowest one among others, which still exceeded requirements of electronic materials.