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Self-stabilizing molecular solution for Cu2SnS3 thin film: An insight into the oxidation inhibitor of bivalent tin ion

Journal 2021 · IF 9.127 · 发表于 2021 年 3 月 21 日
作者: Min Yang,Xiaojuan Huang,Liquan Yao,Limei Lin,Aicheng Chen,Yongqing Chen,Yuliang Che,Shuiyuan Chen,Xiangkai Kong,Guilin Chen
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摘要

Molecular solution with the metal-thiourea complex is a facile and effective route for Cu 2 SnS 3 (CTS) thin film deposition . However, its stability is still challenging due to flexible metal salts precursors. Here we report a strategy to enhance the stability of the Cu–Sn–S molecular solution that use bivalent Sn to suppress the oxidation of the S 2- of thiourea via the redox reaction . The self-stabilizing mechanism has been carefully revealed by the systematic experiments and confirmed by the spontaneous reaction process of metal-thiourea system. It demonstrates that Sn with a low valence state weakens the transfer of lone pair electrons from thiourea to Cu 2+ and Sn 4+ ions, alleviating the sulfur precipitates from thiourea oxidation because of the easily reducible character of Sn 2+ ion. The solution with Sn 2+ antioxidant additive can be stored for a long time under air ambient, which is then spin-coated and sulfurized with Sn powder compensation. The uniform CTS thin film with composition control is finally achieved and delivers a device efficiency of 1.15%. This work provides a guide on stabilizing the solution precursor for chalcogenide thin film deposition.

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