Dielectric, thermal, and mechanical properties of the OAPOSS@GO hybrids enhanced low-κ epoxy composites

Herein, a simple strategy was proposed for multi-scale construction of low-κ epoxy composites by adding a kind of polyhedral oligomeric silsesquioxane@graphene oxide hybrids. Results revealed that the dielectric constant of the composites was decreased with increasing the frequency, and it was decreased first and then increased with increasing the fillers loading. The AC resistivity values of the composites were relatively stable over the entire range of measured frequency (higher than 104 Ω·cm). Moreover, the thermal stabilities and tensile properties of the composites were improved greatly by adding only 0.8 wt% fillers.