New construction of electron thermal conductive route for high-efficient heat dissipation of graphene/Cu composite

High-efficient heat dissipation is essential to maintain the best performance of the electron devices . A new electron thermal conductive route is first proposed and constructed for the graphene metal matrix composites in this work. Functionalization of graphene with conjugated 4-ethynylaniline (FGr) and deposition of FGr and Cu 2+ ions onto the copper surface by pulsed-current co-electrodeposition are successively employed to prepare the FGr/Cu composite. The resulting thermal diffusivity of FGr/Cu is high as 1.444 cm 2  s −1 at 100 °C, which is corresponding to the thermal conductivity of 497 W m −1  K −1 and higher than the reported values via single phonon thermal conductive route. FGr/Cu can maintain a superior and stable thermal conductive property at high temperature with a multiple of 1.61 and 1.31 at 100 °C and 150 °C compared to the Cu, respectively. The delocalized conjugated π bond in the graphene/Cu interface is successfully established through the bridging of graphene and metal with conjugated organic molecule possessing p orbits, which leads to the construction of a new electron thermal conductive route. This innovation presents an entirely new direction to develop graphene-based metal matrix composite with high-efficient heat dissipation.