摘要
Various fillers and methods have been utilized to enhance the thermal conductivity ( TC ) of polymer-based electronic packaging materials, however, the enhancement was limited by disconnected pathway for phonon transferring. Herein, a novel fibrillated hybrid skeleton (f-AO@BNNS skeleton) was fabricated by dispersing boron nitride nanosheet (BNNS) into alumina (AO) sol, electrospinning and sintering, where long-range phonon transferring highway was successfully constructed by both macroscopically interconnected fiber and microscopically oriented and overlapped BNNSs confined in nanofiber . Besides, crystal AO and atomic-level bonding were acquired on BNNS-AO interface by sintering, largely decreasing interface thermal resistance inside skeletons. Prepared polybenzoxazine/f-AO@BNNS composites exhibited the highest TC of 3.24 Wm −1 K −1 at a skeleton loading of 6.9 vol%. The higher TC was achieved at lower filler content when compared with other reported skeletons, demonstrating the superiority of f-AO@BNNS skeleton. This work provides a new strategy of preparing fibrillated hybrid skeleton for high thermally conductive composites.
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