Effects of texture orientation in Ti3SiC2 on growth kinetics of interfacial compound layers in diffusion bonded TiAl/Ti3SiC2 joints

Adjusting the growth kinetics of the interfacial compound layers may be a feasible way to enhance joint properties or service performance. In this study, the textured Ti 3 SiC 2 was obtained by hot-deforming the sintered Ti 3 SiC 2 (TSC), and the effects of the texture orientation on the interfacial microstructural evolution and growth kinetics of the interfacial compounds in the diffusion bonded TiAl/Ti 3 SiC 2 joints were investigated. The texture orientation of Ti 3 SiC 2 had little effect on the interfacial microstructural evolution but had a significant effect on the growth kinetics. When bonded at the same temperature, the growth rate of the interfacial compound layers in the TiAl/TSC ∥ joint (TSC ∥ , TSC ⊥ : Ti 3 SiC 2 with [0001] texture orientation parallel, perpendicular to the bonded seam) was fastest; which was slowest in the TiAl/TSC ⊥ joint and was in the middle in the TiAl/TSC joint. The highest shear strengths of the three different joints were similar (about 54 MPa).