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Cross-linked poly(benzoxazole-co-siloxane) networks with high thermal stability and low dielectric constant based on a new ortho-amide functional benzoxazine

Journal 2020 · IF 2.52 · 138(6): 49792 · 发表于 2020 年 8 月 11 日
作者: Rui Yang,Boran Hao,Lin Sun,Kan Zhang
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摘要

In this study, an amide functionalized bis-benzoxazine (AI-al) has been synthesized using allylamine, ortho -amide functional bis-phenol and paraformaldehyde as raw materials via Mannich condensation. This newly obtained benzoxazine has been used to react with polydimethylsiloxane (PDMS) through hydrosilylation to form poly(benzoxazine- co -amide- co -siloxane) (AI-al-PDMS) featuring siloxane, amide and benzoxazine as repeating units. The chemical structures of both oxazine ring-containing monomer and copolymer are confirmed by NMR and FT-IR spectroscopies. Besides, the thermally activated polymerization behaviors of AI-al and AI-al-PDMS are investigated by DSC, and the subsequent conversion of benzoxazole formation is studied by in situ FT-IR. Moreover, dynamic mechanical analysis and thermogravimetric analysis are used to determine the thermal properties of the cross-linked polymers. The resulting cross-linked poly(benzoxazole- co -siloxane) derived from AI-al-PDMS shows excellent thermal stability (no T g can be observed before 400°C; Td5 of 393°C) and low dielectric constants (2.52–2.13 in the frequency range of 1 Hz to 1 MHz), evidencing its great potential applications in electronic packing, aerospace, and other high-performance fields.

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