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Soluble Polyimide-reinforced TGDDM and DGEBA Epoxy Composites

Journal 2020 · IF 3.154 · 38(8): 867-876 · 发表于 2020 年 5 月 22 日
作者: Chen Qi,Wang Shun,Qin Feng,Liu Kuan,Liu Qian,Zhao Qing,Wang Xing-Yi,Hu Yan-Hong
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摘要

Polyimide (PI) synthesized from aromatic diamine and dianhydrides via two-step poly-condensation method was highly soluble in TGDDM (MY-720) and DGEBA (E-51) at desirable temperature. TGDDM-PI (M-PI) and DGEBA-PI (E-PI) composites within 0.5%-3% PI loading could be prepared without organic solvent. On the cryogenically fractured surfaces of M-PI and E-PI composites, no obvious heterogeneous phase was observed by SEM. The mechanical properties were promoted significantly by PI, especially for impact strength. Adding 2% PI-2W into MY-720 and E-51 composites, the impact strength increased to 21 and 51 kJ/m 2 , the tensile strength increased by 62% and 19%, and the flexural strength by 18% and 13%, respectively, with slight increases in tensile modulus. These results were related to the promotion in plasticity of composites and changes in fragile→ductile fracture mode. Moreover, T g and thermal stability of M-PI and E-PI were increased effectively.

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