Microplasma direct writing of a copper thin film in the atmospheric condition with a novel copper powder electrode

This study presents the microplasma direct writing of copper film in the open air using a novel copper powder electrode. The powder electrode acted as a high-voltage electrode and the precursor source. The deposition process is realized through ion sputtering of the powder in the microplasma. The bombarded copper nanoparticles were deposited and accumulated on a silicon substrate. The deposited film is composed of copper nanoparticles with sizes in the range from tens to hundreds of nanometers, and its electrical conductivity could reach 3.96 × 10 5 S/m. The morphologies, chemical compositions and electrical property of the thin film can be adjusted by changing the input current, and maskless film deposition with different micropatterns can be achieved by direct microplasma scanning.