Silver nanowires intercalating Ti3C2Tx MXene composite films with excellent flexibility for electromagnetic interference shielding

Ultrathin, lightweight and flexible electromagnetic interference (EMI) shielding films are urgently desired for the next generation electronic devices with complex-shaped surfaces. In this study, flexible EMI shielding composite films were fabricated by intercalating sliver nanowires (AgNWs) into Ti3C2Tx MXene nanosheets followed by a pressured-extrusion film-forming process. The resultant MXene/AgNW composite films with a low loading of nanocellulose (0.167 wt%) as a green binder exhibited remarkable conductivity (∼30 000 S m−1) and outstanding specific EMI shielding effectiveness (SSE/t, 16 724 dB). Thanks to the strengthening mechanism of the “brick-and-mortar” layered structure, the tensile stress of the MXene/AgNW composite film dramatically improved from 1.29 MPa (pure Ti3C2Tx film) to 63.80 MPa, and the electric conductivity and EMI SE can be maintained even after bending at 135° 10 000 times. The MXene/AgNW hybrid films with excellent EMI SE and mechanical robustness offered promising applications in the fields of aerospace, defense, smart electronics and flexible/wearable devices.