Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

There is a growing demand for silver pastes and inks used in the field of printed electronics. The synthesis of organic surfactant stabilized silver micro-flakes by the solution-phase chemical reduction method at room temperature has attracted wide attention due to its simple equipment, convenient operation and affordable price. However, the electrical conductivity of silver micro-flakes-filled conductive pastes and inks are significantly influenced by residual surfactants. Therefore, the surface modification of silver micro-flakes to remove surface adsorbents becomes a key issue. In this study, the silver frameworks based on the self-sintering silver micro-flakes at room temperature are developed for silver pastes with excellent conductivity. The silver paste with 48 wt% of the sodium nitrate and succinic acid treated silver powders has a resistivity of 1.08 × 10 −6 Ω m and excellent adhesion strength after being cured at 140 °C in an oven.