摘要
The 3D Ni/NiO/MoO 3 /chitosan foam was fabricated and the interfacial barrier of p-n junction was proposed as a driving factor for electrochemical detection of Cu 2+ . The electrochemical response resulted from the decreased barrier height caused by the absorbed Cu 2+ . The liner range (0–25 μM) and the lower detection limit (5.69 nM) were obtained. The direct electrochemical detection of Cu 2+ in real water sample with excellent stability and recovery was achieved. It affords a new approach to achieve the direct electrochemical detection of metal ions with depressed interference by employing the interfacial effects of p-n junction.
危险品化学品经营许可证(带存储)