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Intrinsic high thermal conductive co-polyester based on offset π-π stacking

Journal 2019 · IF 3.621 · 发表于 2019 年 9 月 27 日
作者: Weilong Chen,Kun Wu,Zhencai Qu,Mangeng Lu
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摘要

It has been known that phonon mean free path along polymer chains is much larger than in transverse directions because weak interaction between polymer chains leads to chain distortion and entanglement. In order to improve intensity of intermolecular interaction, a series of co-polyesters (CPE) containing different content of offset π-π stacking structure in side chains were synthesized by means of polycondensation and transesterification in this work. WAXD patterns unfolded diffraction peak at 2θ of 27.6°, standing for structure of offset π-π stacking. On enlarging intensity of offset π-π stacking interaction, specific heat capacity of CPE increased from 1.140 Jg −1 K −1 to 1.410 Jg −1 K −1 and thermal diffusivity rose from 0.194mm 2 s −1 to 0.245mm 2 s −1 . As a result, CPE sample exhibited excellent thermal conductivity (TC) of 0.381 Wm −1 K −1 , which is around twice that of traditional thermoplastics. Hence offset π-π stacking interaction could strengthen capacity of heat absorption and thermal conduction at the same time, which might be a good candidate for enhancing thermal conductivity of intrinsic polymers. Furthermore, strong π-π interaction in side chains could maintain modulus when temperature is over glass temperature. And the Young modulus grew from 0.14 GPa to 0.44 GPa with the augment of offset π-π stacking structure.

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