Pressureless joining of SiC ceramics at low temperature

Pressureless joining of SiC ceramics at low temperature was developed using Ti powder interlayer. Phase assemblage and microstructure of SiC joint revealed that the products after diffusion bonding mainly consisted of Ti 5 Si 3 and TiC owing to the comparatively low joining temperature. Additionally, Si and C elements were found to be with higher penetration depth in the Ti interlayer. Benefitting from the lower proportion of the brittle Ti 5 Si 3 phase and porosity, shear strength reached a relatively higher value of 41 MPa after joining at 1200 °C for 30 min.