摘要
The click chemistry reaction between 2, 2-dimethylethynyl carbinol (MBY) and tosyl azide (TA) was used to form triazole films on copper surface. The effect of cuprous ions on the assembled films was investigated by the electrochemical measurements. The assembled films have the best protection efficiency of 93.8%. The attack of chloride ions gives out cuprous ions to catalyze the formation of compact triazole films. It shows that the assembled films have an anodic passivation role, and suppress the anodic corrosion reactions evidently. The role of cuprous ions on the films formation during the assembling process is discussed.
危险品化学品经营许可证(带存储)