Preparation and properties of polyurethane-organic silicone copolymerized electronic packaging materials

A novel electronic packaging material made of polyurethane-organic silicone copolymer was prepared by using hydroxyl terminated polybutadiene (HTPB) and α,ω-dihydroxy polydimethylsiloxane (PDMS) as soft segments, and isophorone diisocyanate (IPDI) as hard segments. The correlation between the structure and properties of the electronic packaging material was studied with a series of samples prepared by different mass ratios of HTPB and PDMS. Several techniques, including FTIR, DSC, XRD, TG, and mechanical testing, were employed to characterize the structure and properties, including micro-phase separation, thermal stability, and mechanical property of the products. It was found that the micro-phase separation between the soft segments and the hard segments was related to the mechanical properties, adhesive properties, and the thermal stability of the copolymer. The preparation conditions were further investigated to obtain electronic packaging materials with ideal properties. The electronic packaging adhesive with optimum properties was achieved under the preparation condition of PDMS mass content of 5%–7%.