A ceramizable adhesive with high temperature resistance at 1400°C: Bonding strength and bonding mechanism

In this study, two types of high-temperature adhesives were prepared using molybdenum-modified phenolic resin (MoPF) as the matrix and TiB 2 or TiB 2 /ZrSi 2 particles as active fillers for bonding Al 2 O 3 ceramic substrates. Shear strength testing, thermo gravimetric analysis (TGA), scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) were employed to investigate the bonding properties, thermal properties, microstructure, compositional evolution, and bonding mechanism of the adhesives. The results demonstrate that MoPF-TiB 2 /ZrSi 2 adhesive exhibits superior bonding properties than MoPF-TiB 2 adhesive. It is noteworthy that the incorporation of ZrSi 2 can mitigate the internal stress induced by rapid volume expansion of the adhesive, and ensuring high density and mechanical strength through the generation of ZrB 2 and ZrTiO 4 , which effectively prevents the sudden decline in bonding performance beyond 1200℃. The mechanical strength of the adhesive can still be maintained at 31.5 MPa after treatment at 1400℃.