摘要
Organic thin-film transistors (OTFTs), the key component of the future wearable electronics, have the outstanding advantages including cost-effective, low-temperature, and large-area production. However, all-organic TFTs with an all-solution process and high-precision electrode pattern remain an enormous challenge due to dissolution and incompatible fabricated processes between functional layers. Here, a universal, solution-free transfer and lamination strategy is proposed, which is totally compatible with various commercial materials and fabricated technique in transistors. Excellent mechanical stability, good operation, high-precision electrode patterns, and outstanding conformability are observed in the all-organic TFTs. Moreover, as a proof-of-utility for the strategy, the all-organic complementary inverters are fabricated based on all dry-transfer processes with gain value of 11.2 and stable properties in 30 days in the air. This work provides a universal, solution-free transfer and lamination strategy to fabricate high-precision, all-solution-processed, all-organic devices fully maximizing the great advantages of organic materials for the future multilayered functional, commercialized, and industrialized flexible electronics.
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