Cr incorporation and hybrid bond control in amorphous carbon films for superior thermal radiation efficiency

The high integration of electronic devices severely hinders heat dissipation, impacting intelligent system performance. This study fabricated Cr-incorporated amorphous carbon films on aluminum alloy heat sinks using pulsed bias arc ion plating to enhance thermal performance. Film morphology and composition were analyzed via transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The Cr content was precisely regulated by adjusting the Cr target current, which was set at 0 A, 20 A, 40 A, and 60 A, respectively, and the effect of the sp 2 /sp 3 hybridization ratio on thermal dissipation was investigated. Results showed that increased Cr content led to the formation of B1-CrC in the amorphous carbon matrix. Optimal thermal performance occurred at a Cr target current of 20 A, at which the Cr content reached 6.21 at.%, yielding an infrared emissivity of 0.67 and a thermal conductivity of 160.95 W·m −1 ·K −1 . LED lamps coated with the Cr/C film exhibited a surface temperature 9.7 °C lower than that of uncoated lamps, thereby demonstrating excellent heat dissipation. The study underscores the synergistic effect of radial thermal conductivity and infrared emissivity in improving heat sink efficiency under non-forced convection.