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Development of SiO2 nanofibre fillers with low-thermal conductivity by regulating heat-treatment process

Journal 2024 · IF 1.9 · 48(1): 1-12 · 发表于 2024 年 12 月 20 日
作者: WU YIFAN,PAN YANGFAN,GUO JUNXIA,MENG YONGQIANG,HUANG HONGJUN
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摘要

Silicon dioxide (SiO 2 ) is considered to be a promising material for thermal insulation. However, the application scenarios of insulation materials are limited, and how to enhance their practical application value has been an attractive research topic. In this work, SiO 2 nanofibres were prepared by the electrospinning technology. Effects of different heat-treatment parameters on SiO 2 crystal transformation, nanofibres’ diameter and thermal conductivity were investigated, and the thermal-insulation mechanism of SiO 2 nanofibres was further studied. Results of the study show that the heat-treatment process has a significant effect on nanofibre diameter, which affects thermal conductivity. When the heat-treatment temperature is 900°C, the heating rate is 8°C min −1 and holding time is 2 h, the diameter of SiO 2 nanofibres is the finest, and thermal conductivity is the lowest (0.039 W mK −1 ). In addition, nanofibres is demonstrated as functional fillers of thermal-insulation coating, which exhibit excellent thermal insulation and mechanical properties. This study can provide a certain reference value for the development of new lightweight and functional thermal-insulation fillers.

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