Electrodeposition of antibacterial, anti-corrosion copper nanopillars arrays with heat conductive properties for marine environments

Copper materials have emerged as the preferred choice for marine heat exchangers owing to their exceptional thermal conductivity. The enhancement of surface performance can be significantly achieved by engineering micro-nano structures on the material's surface, thereby attaining improved corrosion resistance and antibacterial properties in complex marine environments. In this study, we directly fabricated a copper nanopillar array structure on the substrate via template-assisted electrodeposition. Subsequently, passivation of the pillar-structured copper surface was achieved through a formate & dodecanethiol-assisted solvothermal process (Cu/FA-DT). The results indicate that the nanopillar structure effectively eliminates bacteria through physical rupture upon contact, leading to an 85.47% reduction in P. aeruginosa adhesion compared to untreated samples after 72 h of immersion in seawater. Furthermore, corrosion resistance is significantly enhanced, with inhibition rates of approximately 95.27% and 90.50% in natural and P. aeruginosa containing seawater, respectively. Notably, the thermal conductivity of copper is well preserved, ensuring its functional integrity in marine heat exchange environments. After 7 days of immersion in natural and P. aeruginosa containing seawater, the thermal conductivity of Cu/FA-DT decreased by only 15.41% and 2.78%, respectively, demonstrating superior thermal conductivity retention compared to untreated bare copper. This study provides valuable insights into the potential application of traditional copper in marine heat exchange environments.