Enhanced Thermal Conductivity of EP Composites by Introducing BN-Al2O3 Hybrid

Massive heat generated by electronic components during continuous operation will affect the operation of the equipment, so it is of significance to face up to the heat dissipation problem of electronic packaging materials. Epoxy resin (EP) is widely applied to electronic components for its excellent electrical insulation and processability. To improve the thermal conductivity of composites, this study prepared BN-Al 2 O 3 /EP composites by adding a hybrid of modified boron nitride (mBN) and modified alumina (Al 2 O 3 ) into EP. Profiting from the high thermal conductivity and low dielectric constant of BN and Al 2 O 3 , the thermal and dielectric properties of EP composites were improved. Specifically, the composite of 4 wt.% BN-3 wt.% Al 2 O 3 not only occupied the high thermal conductivity 0.25 W/(m K) at 50°C, but also kept the relatively inferior dielectric constant (4.27) and the low dielectric loss (0.0037) at 10 2  Hz. The composite could be applied in electronic packaging materials as it has excellent dielectric properties and high thermal conductivity.