Fabrication of Cu-Ni Alloy Microcomponents using Localized Electrochemical Deposition

With the rapid development of electronics, additive manufacturing of complex three-dimensional microscale metal and alloy structures has emerged as one of the future directions for advanced technologies. In this study, a localized electrochemical deposition technique was developed which enables the fabrication of microscale three-dimensional metal structures in an ambient environment. Notably, we investigated the effects of voltage, initial electrode gap, and electrolyte composition on the deposition of Cu-Ni alloy. Furthermore, we successfully fabricated Cu-Ni equiatomic micro-columns, providing possibilities for the micro/nanoscale fabrication of commercial K-Monel copper. Finally, based on these foundations, we successfully shaped overhanging structures with various angles as well as an "H" structure using a rotating cathode substrate, demonstrating their potential in the fabrication of Cu-Ni alloy micro components.