摘要
The advent of the 5G era has significantly increased device power density and integration, intensifying heat dissipation challenges in electronic devices. The exploration and development of novel thermally conductive materials have become critical for the next generation of electronic devices. This work presents a novel method for the efficient and energy-saving preparation of advanced thermal conductive materials. A high-performance, thermally conductive bio-based UV-cured polymer (AESO-GAGMx) was synthesized from epoxy soybean oil (ESO) and gallic acid (GA). Its intrinsic in-plane thermal conductivity of 1.08 Wm −1 K −1 exceeds most reported polymer materials. Furthermore, composite films (A-BNx) with superior thermal conductivity were fabricated by the novel method, using AESO-GAGMx and hexagonal boron nitride (h-BN). This material shows potential for application in thermal management of electronic devices. The A-BNx composite thermally conductive film and its preparation method offer a novel approach to designing thermal management materials.
危险品化学品经营许可证(带存储)