Multi-strategy preparation of para-aramid paper with high interfacial bond strength

Poor interfacial bond strength and complex processing limit the widely use of para-aramid paper. Here, the meta-poly(p-phenylene terephthalamide) (MPPTA) was obtained by introducing poly(m-phenylene isophthalamide) (PMIA) segments into the PPTA rigid molecular chains via secondary polymerization. The rigid-soft molecular structure not only gives MPPTA excellent thermal stability, but also enables the MPPTA fibrids to bond to the PPTA chopped fibers by plastic deformation during hot pressing. The tensile strength of Precipitated-MPPTA-paper (P-MPPTA-p) was increased by 20.3 % compared to Precipitated-PMIA-paper (P-PMIA-p). And the interfacial bond strength of aramid paper can be further improved by combining MPPTA solution and PPTA nonwoven fabric through a simpler and more efficient solution casting method, which together with more moderate hot pressing conditions can lead to the tensile strength of aramid paper up to 109.1 MPa, as well as exhibiting higher resistance to tearing and heat aging. The present study provides a new idea for the efficient preparation of para-aramid paper with excellent comprehensive performance.