Solvent-free Acrylate/BCB drop-on-demand (DOD) inkjet dielectric ink for 3D printing

Currently, drop-on-demand (DOD) inkjet-printed dielectric inks used to produce next-generation high-frequency electronic devices fail to meet the requirements of circuit board substrates in terms of thermal, mechanical, and dielectric properties. To address this gap, we synthesized a low-viscosity acrylate monomer featuring an intrinsically low dielectric structure (hexafluorobisphenol A) and multiple cross-linking sites, and a benzocyclobutene monomer with low curing shrinkage and excellent thermomechanical properties. By mixing these monomers with other reactive diluents and verifying them through theoretical calculations and printing, we have developed a range of dielectric inks suitable for inkjet 3D printing. To enhance the overall performance of the cured inks, a sequential UV/thermal curing strategy was employed to form interpenetrating networks (IPNs). The optimal ink formulations met the requirements of circuit board substrates, demonstrating excellent heat resistance (T d5% = 334 °C, T g  = 181 °C), mechanical properties (tensile strength = 85 MPa, elongation at break = 13.5 %), and dielectric properties (D k  = 2.526 and D f  = 0.113 at 15 GHz). These formulations meet the performance requirements for circuit board substrates and lead the industry in mechanical and dielectric properties. Furthermore, the feasibility of inkjet printing heterogeneous integrated electronic devices was verified, showing excellent print resolution and continuity of the conductive network. This work provides new insights into the future development of dielectric materials for inkjet 3D printing.