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Dual-fixation strategy for preparing PCM/PVA electrospun membranes: High encapsulation efficiency and thermal reliability

Journal 2025 · IF 7.2 · 发表于 2025 年 8 月 14 日
作者: Chi Hu,Yuqing Sun,Zhijun Zhang,Xuanyu Chen,Zihang Li,Xiong Liang,Bainan Li,Chongxing Huang
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摘要

Phase change materials (PCMs), capable of absorbing or releasing substantial energy during phase transitions, represent a promising class of clean energy solutions. Owing to their eco-friendliness, excellent thermal reliability, recyclability, and high energy storage density, PCMs have found widespread applications in food preservation, energy systems, construction, and other fields. The encapsulation method of PCMs critically determines their practical applicability and commercial value, making it a focal point of research. This study improves upon the conventional "one-pot" method by employing a Pickering emulsion process to obtain phase-change microcapsules, achieving primary encapsulation of PCMs through a self-assembled core-shell structure. Subsequently, electrospinning technology is utilized to fabricate fibers with a sheath-core-shell structure, realizing secondary encapsulation of PCMs. As demonstrated in this study, this innovative stabilization strategy achieves an encapsulation efficiency as high as 81.09 %, while the composite film maintains exceptional thermal reliability even after 500 thermal cycles. The entire process uses water as the sole solvent, incorporates low-cost raw materials, and follows a simple and eco-friendly production protocol, resulting in products that are both environmentally friendly and biodegradable. Moreover, the raw materials and fabrication process fully comply with food safety standards, highlighting their significant potential for flexible food packaging applications. This dual-immobilization strategy exhibits broad applicability in oil-water biphasic system, ensuring effective encapsulation while avoiding complex and time-consuming synthesis processes. With strong potential for large-scale industrial production, this approach provides a novel solution to PCM encapsulation challenges and significantly enhances the practical utility of phase change materials in real-world applications.

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