A Novel One-step Thermal Decomposition Route for High-Conductivity Mock-strawberry Shaped Copper Nanoparticles

Copper nanoparticles (Cu NPs) have garnered significant attention in electronic printing owing to their remarkable conductivity and cost-effectiveness. Nevertheless, balancing excellent oxidation resistance with a low annealing temperature remains a formidable challenge. Hence, this study focuses on a novel method for the synthesis of mock-strawberry shaped Cu NPs utilizing alkaline copper carbonate as the precursor and oleylamine (OAM) as a dual function agent. SEM analysis reveals a unique structure featuring a 48   nm diameter core particle decorated with 4.5   nm shell particles. These OAM-stabilized Cu NPs exhibit robust antioxidant properties and a distinctive morphology conducive to the fabrication of conductive films. By employing a process that involves dispersion, spraying, and sintering, these NPs exhibit an impressive resistivity of 132.2 μΩ·cm, even at a relatively low annealing temperature of 220 °C. This achievement signifies a significant advancement in the field, addressing the long-standing challenge of balancing oxidation resistance with a low processing temperature.