High-strength and debondable UV-curable adhesive based on dual-dynamic network

The temporary fixation of precision devices during manufacturing demands adhesives capable of high efficiency and controlled debonding, while existing thermosetting adhesives face challenges in on-demand debonding due to irreversible covalent crosslinking. To address this dilemma, UV-curable polyurethane acrylate adhesive (DSPUA) integrating dual-dynamic networks of hydrogen bonds and disulfide bonds was developed. This synergy between dynamic networks effectively resolved the trade-off between adhesive strength and on-demand debonding capability. The dual-dynamic network provided strong and tough adhesive strength (5.88 MPa and 8.99 kN/m), surpasing that of existing UV-curable adhesives featuring controlled debonding. The disulfide bonds enabled rapid debonding at medium temperatures (complete detachment within 4 min at 90 °C). In addition, the DSPUA-2 adhesive also experienced a significant reduction in adhesive strength when exposed to ultraviolet light or in the presence of chemical reducing agents. This work paves the way for the design of high-performance and debondable adhesives, with significant implications for temporary fixation of precision components and material recycling.