Synthesis of Fluorinated Hollow MoS2 Nanospheres for Low Dielectric Constant PEEK Composites With Enhanced Thermal Stability

The dielectric constant, thermal stability, and mechanical properties of dielectric materials play a crucial role in advancing electronic devices toward high performance and integration density. However, the comprehensive properties of existing PEEK-based low dielectric materials are insufficient to meet future demands. In this work, hollow molybdenum disulfide nanospheres (hMoS 2 ) were prepared by the template method and hydrothermal reaction, and then modified with 1H,1H,2H,2H-Perfluorodecanethiol (PFDT) to obtain fluorinated hollow molybdenum disulfide nanospheres (F-hMoS 2 ). Subsequently, the F-hMoS 2 was blended with poly (ether ether ketone) (PEEK) to form F-hMoS 2 /PEEK composites. Morphological, structural, and chemical composition characterization confirmed the successful synthesis of F-hMoS 2 . The results showed that the addition of F-hMoS 2 effectively reduced the dielectric constant of PEEK composites while enhancing their thermal stability and mechanical properties. The F-hMoS 2 /PEEK-0.6 composite exhibited a dielectric constant of 2.75 at 1 MHz, a thermal decomposition temperature of 541.7°C, and a tensile strength of 101.7 MPa. In addition, the composite exhibited better frequency stability, a higher glass transition temperature (154.5°C), and storage modulus (3200 MPa) compared with pure PEEK. This work establishes a materials design paradigm for the practical application of PEEK in electronic devices.