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Tin-Lead-Selenide Nanocrystals for Sensitive Uncooled Mid-Infrared Focal Plane Array Imager with Monolithic Readout Integration

Journal 2025 · IF 26.8 · 发表于 2025 年 6 月 27 日
作者: Yifan Chen,Qi Wei,Shuixian Yang,Tao Zhang,Hongfei Chen,Zhihao Fu,Chao Lu,Zhengyong Liu,Yanxiong Wu,Jingshun Pan,Mingjie Li,Zhaohui Li
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摘要

The mid-infrared focal plane array (FPA) imager has developed over recent decades to become multifunctional, powerful, reliable, miniaturized, and cost-effective. However, the complexity of the refrigerated packaging process (such as dewar flask) and traditional fabrication technology (such as flip-chip) continues to contribute significantly to the high cost of industrial production. Here, a simple, low-cost, and effective type of uncooled mid-infrared FPA imager is reported through the monolithic integration of mid-infrared Pb 1-x Sn x Se nanocrystals (NCs) PIN heterojunction (PbS/Pb 1-x Sn x Se/ZnO) photodetectors and glass-based readout integrated circuits (ROICs). Sn-doping in PbSe NCs not only weakens the internal photocarrier-phonon coupling to reduce thermal noise but also optimizes the energy band structure of the heterojunction to enhance mid-infrared performance. Finally, the PbS/Pb 0.86 Sn 0.14 Se/ZnO heterojunction photodetector demonstrates a dark current (2.7 x 10 −7 A mm −2 at −0.5 V), a detectivity of 7.46 × 10 9 Jones at a peak wavelength of 4.25 µm, air stability (retaining 96.7% performance at 300 K for 360 days) and the corresponding uncooled mid-infrared FPA (64 × 64 pixels) achieves excellent thermal sensitivity of 133 mK. These results underscore the substantial potential applications of mid-infrared FPA based on the heterojunction, including spectral imaging, gas leak detection, and chemical reagent identification.

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